Thermally controlled assembly
US9155223B2 · kind B2 · utility
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11References
11Claims
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Assignee
Inventor
Key dates
| Filing date | Apr 19, 2011 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | May 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.