Thermally controlled assembly
US9155224B2 · kind B2 · utility
0Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2011 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | May 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.