Non-planar chip assembly
US9155881B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2011 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A non-planner integrated circuit device comprising a flexible structure and at least one fixture structure bonded to the flexible structure is described. The flexible structure may be curved in a desired deformation. A plurality of contact areas may be included in the flexible structure. Circuitry may be embedded within the flexible structure to perform processing operations. In one embodiment, the fixture structure may be bonded with the fixture structure via the contact areas to provide holding constraints allowing the flexible structure to remain curved. The bonding pads can also be used to connect communications in electrical signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.