Manufacturing method of liquid ejecting head
US9156265B2 · kind B2 · utility
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Key dates
| Filing date | Mar 11, 2014 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14419
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A piezoelectric actuator which is provided on the flow path formation substrate, and a protection substrate which is bonded to the flow path formation substrate on the piezoelectric actuator side, the method including: bonding the flow path formation substrate on which the piezoelectric actuator is formed, and the protection substrate to form a bonded body; bonding a sealing member to the protection substrate of the bonded body on the surface side opposite the flow path formation substrate, and disposing a protection material containing a nitro compound in a space between the sealing member and the protection substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.