Method for cutting chemically strengthened glass
US9156721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Jan 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.