Method of operating a processing chamber used in forming electronic devices
US9157150B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2007 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4401
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided herein is a method of processing an electronic device including operating a processing chamber at a first temperature while a workpiece is being processed and removing the workpiece and a carrier holding the workpiece from the processing chamber while decreasing the temperature within the processing chamber to a second temperature significantly lower than the first temperature. The method also includes increasing the temperature within the processing chamber to a third temperature significantly greater than the second temperature and significantly less than the first temperature while the processing chamber has no workpiece or carrier within.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.