Manufacture method for a surface mounted power LED support and its product
US9157610B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2010 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Aug 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49996
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.