Patent · US Active

Method and device for detecting cracks in semiconductor substrates

US9157869B2 · kind B2 · utility

6Cited by

6References

20Claims

0Family size

Assignee

Schott AG · DE

Inventors

Andreas Ortner · Gau-Algesheim, DE
Klaus Gerstner · Mainz, DE
Hilmar Von Campe · Bad Homburg vor der Höhe, DE
Michael Stelzl · Mainz, DE

Key dates

Filing date	Aug 13, 2010
Grant date	Oct 13, 2015
Priority date	—
Expiry date	Oct 21, 2031

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/9505
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells, are provided. The method and apparatus are based on the detection of light deflected at a crack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.