Patent · US Active

Glass wafers for semiconductors fabrication processes and methods of making same

US9159587B2 · kind B2 · utility

2Cited by

8References

5Claims

0Family size

Assignee

CORNING INCORPORATED · US

Inventors

Joseph E. Canale · Corning, US
Jeffrey Stapleton King · Menlo Park, US
Gary Richard Trott · San Mateo, US

Key dates

Filing date	Sep 17, 2014
Grant date	Oct 13, 2015
Priority date	—
Expiry date	Sep 17, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16145
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure is directed to the use of glass wafers as carriers, interposers, or in other selected applications in which electronic circuitry or operative elements, such as transistors, are formed in the creation of electronic devices. The glass wafers generally include a glass having a coefficient of thermal expansion equal to or substantially equal to a coefficient of thermal expansion of semiconductor silicon, an indexing feature, and a coating on at least a portion of one face of the glass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.