Patent · US Active

Silicon-based heat dissipation device for heat-generating devices

US9159642B2 · kind B2 · utility

4Cited by
10References
19Claims
0Family size

Inventors

Key dates

Filing dateJun 28, 2013
Grant dateOct 13, 2015
Priority date—
Expiry dateApr 9, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.