Conductive adhesive composition, electronic device, positive electrode laminate, and method for manufacturing electronic device
US9159940B2 · kind B2 · utility
3Cited by
1References
8Claims
0Family size
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Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Oct 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2804
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electronic device having, arranged in the following order, a cathodic layer, a conductive layer, a photoelectric conversion layer, and an anodic layer. The conductive layer contains a conductive adhesive composition which contains:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.