Wireless device
US9160055B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Apr 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a wireless device is provided with a semiconductor chip, a substrate, an antenna, and a sealing material. The chip includes a wireless circuit. The substrate has a plurality of terminals arranged on a first surface and the chip arranged on a second surface. The antenna includes a radiation element and is electrically connected to the chip. The sealing material seals the chip and the antenna. A distance between a first wall of the sealing material substantially parallel to the second surface and the radiation element is equal to or more than a distance between a second wall of the sealing material substantially perpendicular to the second surface and the radiation element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.