Acoustic wave band reject filter
US9160302B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2013 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Oct 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6483
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method and system for an acoustic wave band reject filter are disclosed. According to one aspect, an acoustic wave band reject filter includes a substrate and a plurality of acoustic wave band reject filter circuit blocks. The substrate includes bonding pads formed on the substrate. Each one of the plurality of acoustic wave band reject filter circuit blocks is fixed on a separate die. Each separate die has solder balls on a side of the die facing the substrate. The solder balls are positioned to electrically connect the bonding pads formed on the substrate to electrodes of the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.