Printed circuit board and method for manufacturing the same
US9161460B2 · kind B2 · utility
2Cited by
6References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 30, 2011 |
| Grant date | Oct 13, 2015 |
| Priority date | — |
| Expiry date | Mar 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0239
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.