Multilayer wound dressing with conductive regions
US9161859B2 · kind B2 · utility
0Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 5, 2011 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Apr 13, 2032 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2013/0034
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Provided is a wound dressing including a wound pad of absorbent material having a first side and a second side opposite thereto, a backing layer covering the wound pad on the first side thereof an adhesive layer for attaching the dressing to skin. The backing layer has at least one conductive region and consists of plastic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.