Grooved circuit board accommodating mixed-size components
US9162303B2 · kind B2 · utility
0Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2011 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Aug 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.