Polishing pads including phase-separated polymer blend and method of making and using the same
US9162340B2 · kind B2 · utility
38Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2010 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Dec 22, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads containing a phase-separated polymer blend, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.