Carrier head and carrier head unit
US9162342B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving space being opened downward to receive the substrate, a housing part in an edge thereof to surround a side portion of the receiving space, a main passage passing through the head main body to communicate with the receiving space, and a plurality of connecting holes vertically passing through the housing part to communicate with the main passage, a retaining ring coupled to a bottom surface of the housing part of the head main body to close lower portions of the connecting holes, and a cover coupled to a top surface of the head main body to close upper portions of the connecting holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.