Printhead including integrated circuit die cooling
US9162453B2 · kind B2 · utility
24Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jul 30, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/12
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
One example provides a printhead including a substrate and a fluidics structure attached to the substrate. The fluidics structure includes actuators for ejecting ink from the printhead. The printhead includes an integrated circuit die attached to the substrate. The integrated circuit die is for driving the actuators. The integrated circuit die is cooled by a coolant contacting the integrated circuit die and flowing through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.