Component and method for producing same

US9162873B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jochen Zoellin · Memmingen, DE
• Ricardo Ehrenpfordt · Gerlingen, DE
• Christoph Schelling · Stuttgart, DE
• Juergen Graf · Stuttgart, DE
• Frederik Ante · Stuttgart, DE
• Michael Curcic · Stuttgart, DE

Key dates

• Filing date: Nov 8, 2013
• Grant date: Oct 20, 2015
• Expiry date: Nov 8, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/20
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A packaging concept for MEMS components having at least one diaphragm structure formed in the front side of the component is provided, according to which the MEMS component is mounted on a support which at least laterally delimits a cavity adjoining the diaphragm structure. In addition, at least one electrical feedthrough is formed in the support which allows electrical contacting of the MEMS component through the support. To achieve the largest possible rear volume for the diaphragm structure of the MEMS component for a given chip surface area, and also to simplify the processing of the support, according to the invention the electrical feedthroughs are integrated into the wall of the cavity adjoining the diaphragm structure, in that at least one section of such a feedthrough is implemented in the form of an electrically conductive coating of a side wall section of the cavity.