Panel assembly having thin bondline with reduced edge stress
US9162915B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2011 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jan 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1075
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A structure may include a first layer, a second layer, and an adhesive layer. The first layer may have a faying surface, a side edge, and a first coefficient of thermal expansion. The second layer may also have a faying surface, a side edge, and a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion. The adhesive layer may be interposed between the first and second faying surfaces. The faying surface of at least one of the first and second layers may include an edge treatment extending along at least a portion of a respective one of the side edges. The edge treatment may have an edge treatment length measured along a direction generally parallel to the faying surface and an edge treatment height measured along a direction generally perpendicular to the faying surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.