Adhesive compositions having a reduced cure time and methods for making and using same
US9163169B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Mar 12, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J161/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or more cure accelerants. The one or more cure accelerants can be selected from the group consisting of: ammonia, ammonium hydroxide, one or more primary amines, one or more secondary amines, one or more tertiary amines, one or more alkanolamines, one or more aromatic amines, one or more polyamines, one or more amides, one or more polyamides, one or more compounds containing at least one amine functional group and at least one sulfur functional group, and any mixture thereof. In one or more embodiments, the adhesive composition can also include one or more hardeners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.