Three-dimensional photoresists via functionalization of polymer thin films fabricated by iCVD
US9163307B2 · kind B2 · utility
2Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | Mar 11, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | May 7, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/24
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are simple, efficient, and scalable methods of patterning polymeric or metallic microstructures on planar or non-planar surfaces. The methods utilize initiated chemical vapor deposition (iCVD) technology. Also disclosed are patterned articles produced by these methods, and methods of using the articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.