Coupling assembly of power semiconductor device and PCB and method for manufacturing the same
US9165856B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jun 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.