Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor

US9165858B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Jürgen Steger · Hiltpoltstein, DE
• Markus Knebel · Tuchenbach, DE
• Andreas MAUL · Koblenzer Straße, DE
• Susanne Kalla · Ebermannsdorf, DE

Key dates

• Filing date: Apr 17, 2013
• Grant date: Oct 20, 2015
• Expiry date: Feb 6, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An arrangement having a cooling circulation, a plurality of modular power semiconductor modules and at least one capacitor, wherein a power semiconductor module has a power electronics switch and a cooling device, which is capable of carrying a flow of a cooling fluid, for cooling the switch, the cooling device having at least one cooling face, and four connection devices for the cooling fluid. The connection devices are arranged in pairs on main sides of the power semiconductor module. The power semiconductor modules have their main sides strung together modularly by connecting corresponding connection devices on successive power semiconductor modules. To this end, at least two successive power semiconductor modules have a capacitor arranged between them which, for its part, is cooled by means of the cooling circulation of the cooling fluid as provided by the arrangement.