Chip scale diode package no containing outer lead pins and process for producing the same
US9165872B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Oct 24, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Oct 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12035
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel chip scale diode package due to no containing outer lead pins is miniaturized like a chip scale appearance to promote dimensional accuracy so that the diode package is so suitably produced by automation equipment to get automated mass production; the produced diode package may contain one or more diode chips to increase versatile functions more useful in applications, such as produced as a SMT diode package or an array-type SMT diode, and the present diode package due to made of no lead-containing material conforms to requirements for environmental protection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.