Patent · US Active

Method and a system for producing a semi-conductor module

US9165907B2 · kind B2 · utility

2Cited by

6References

22Claims

0Family size

Assignee

Interposers GMBH · DE

Inventors

Andreas Jakob · Untermeitingen, DE
Thomas Kaiser · Marion, US

Key dates

Filing date	Feb 22, 2011
Grant date	Oct 20, 2015
Priority date	—
Expiry date	Apr 3, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.