Array substrate, its manufacturing method, and display device
US9165949B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Jun 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an array substrate, its manufacturing method, and a display device. The array substrate comprises a gate metal layer, a gate insulating layer, a source/drain metal layer, first common electrode lines arranged on an identical layer to the gate metal layer, a first via hole arranged in the gate insulating layer and corresponding to the first common electrode line, a source/drain metal filling part arranged within the first via hole, a second via hole in communication with the first via hole, and a transparent connection part. The first common electrode lines are, by means of the transparent connection part and the source/drain metal filling part, in electrical connection with each other through the second via hole. According to the present invention, it is able to reduce the depth of the via holes in the array substrate, and improve the uneven diffusion of an alignment layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.