Light emitting device package and headlight for vehicle having the same
US9166124B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Aug 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8513
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting device package according to example embodiments includes a plurality of light emitting device chips arranged linearly and spaced apart from each other on a substrate, and a plurality of wavelength conversion units on upper surfaces of the plurality of light emitting device chips. The plurality of wavelength conversion units may each have portions that extend over regions between the plurality of light emitting device chips. A vehicle headlight may include the light emitting device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.