Artificial microstructure and metamaterial using the same
US9166272B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 27, 2011 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Feb 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/0086
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention provides an artificial microstructure including a first metal wire, a second metal wire parallel to the first metal wire, at least one first metal wire branch and at least one second metal wire branch. The at least one first metal wire branch and the at least one second metal wire branch are distributed in an interlacement arrangement. One end of the at least one first metal wire branch is connected to the first metal wire; the other end is a free end facing towards the second metal wire. One end of the at least one second metal wire branch is connected to the second metal wire, and the other end of the at least one second metal wire is a free end facing towards the first metal wire. The present invention also discloses a metamaterial with the artificial microstructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.