Surface acoustic wave (SAW) device package and method for fabricating same
US9166553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Dec 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.