Microphone
US9167352B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2014 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Mar 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone has a base substrate having a main surface, an acoustic sensor mounted on the main surface, and a circuit element that processes a signal output from the acoustic sensor. The acoustic sensor has a sensor substrate having a first surface opposed to the base substrate, a second surface on a side opposite to the first surface, and a cavity formed while piercing the sensor substrate from the first surface to the second surface, and a movable electrode that covers the cavity from the second surface side. A through-hole is formed in the base substrate while piercing the base substrate in a thickness direction to communicate with the cavity. The through-hole overlaps the sensor substrate when viewed in the thickness direction of the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.