Flexible printed circuit board, chip on film and manufacturing method
US9167687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2012 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Nov 20, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses a flexible printed circuit board, a chip on film and a manufacturing method. The flexible printed circuit board used for hot pressing includes an insulating substrate with long edges; the insulating substrate is provided with a plurality of pins used for hot pressing; the pins of the flexible printed circuit board used for hot pressing are along the long edge of the insulating substrate; the spacing between two adjacent pins is gradually reduced from both ends to the middle. In the invention, after hot lamination, the spacing between the pins can almost keep constant and is equivalent to the expansion result of the LCD panel; thus, better electrical connection of the pins and the leads of the LCD panel can be ensured, and electrical contact is more reliable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.