Dual interface module and dual interface card having a dual interface module manufactured using laser welding
US9167691B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2013 |
| Grant date | Oct 20, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Dual interface modules, and methods for manufacturing the same, are described. A substrate layer is provided with at least one dual interface section. At least two first through-holes are formed in the substrate in each dual interface section. A first connection element is arranged in each first through-hole. Each first connection element is connected to a contact pad that is arranged on a first side of the substrate. Each first connection element is connected to a connection pad that is arranged on a second side of the substrate. At least one electronic element is arranged on the second side of the substrate in each dual interface section. Two second through-holes are formed in the substrate in each dual interface section. Two soldering pads with a first side and a second side are arranged on the second side of the substrate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.