Panel assembly having multi-layer patch for sound damping
US9168880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2012 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Mar 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49906
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A panel assembly with a multi-layer patch may be used in any number of different applications in order to reduce noise or vibrations, provide thermal insulation, and/or improve the structural integrity of an underlying part. In an exemplary embodiment where the panel assembly is a vehicle part, the panel assembly includes a main panel, a primary adhesive layer, and a multi-layer patch that includes at least two individual patches and at least one auxiliary adhesive layer. The primary adhesive layer attaches the multi-layer patch to the main panel, and the auxiliary adhesive layer attaches the individual patches together. The size, shape, thickness and/or composition of the different layers of the multi-layer patch may be specifically chosen to exhibit certain sound and/or thermal damping properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.