Hybrid integrated component and method for the manufacture thereof

US9169116B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Johannes Classen · Reutlingen, DE
• Paul Farber · Stuttgart, DE

Key dates

• Filing date: Jun 12, 2013
• Grant date: Oct 27, 2015
• Expiry date: Nov 21, 2033

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0785
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

An expansion of the functional scope of a hybrid integrated component including an MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC element having circuit components is provided. In this component, the circuit components of the ASIC element interact with the micromechanical structure of the MEMS element. The MEMS element is mounted on the ASIC element in such a way that the micromechanical structure of the MEMS element is situated in a cavity between the cap and the ASIC element. The ASIC element is additionally equipped with the circuit components of a magnetic sensor system. These circuit components are produced in or on the CMOS back-end stack of the ASIC element. The magnetic sensor system may thus be implemented without enlarging the chip area.