Joint compound, wall assembly, and methods and products related thereto
US9169426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Dec 7, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed are aspects of board finishing systems. For example, in various aspects, disclosed are joint compound compositions, wall assemblies, methods of treating walls, and products related to any of the foregoing, including reinforcement trim, e.g., for protecting corners where boards meet, fasteners, and tape. The joint compound preferably is a drying type composition with reduced shrinkage property, and includes binder and hollow spheres, resulting in an ultra lightweight formulation in some embodiments. The joint compound composition can be applied in a one-coat treatment in preferred embodiments. Other aspects of board finishing system accommodate such a one-coat treatment to thusly allow a user to manipulate the compound closer to the plane of board as compared with conventional formulations. Joint tape and reinforcement trim can include non-swelling synthetic paper facing material in some embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.