Identifying and filling holes across multiple aligned three-dimensional scenes
US9171405B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/2012
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The capture and alignment of multiple 3D scenes is disclosed. Three dimensional capture device data from different locations is received thereby allowing for different perspectives of 3D scenes. An algorithm uses the data to determine potential alignments between different 3D scenes via coordinate transformations. Potential alignments are evaluated for quality and subsequently aligned subject to the existence of sufficiently high relative or absolute quality. A global alignment of all or most of the input 3D scenes into a single coordinate frame may be achieved. The presentation of areas around a particular hole or holes takes place thereby allowing the user to capture the requisite 3D scene containing areas within the hole or holes as well as part of the surrounding area using, for example, the 3D capture device. The new 3D captured scene is aligned with existing 3D scenes and/or 3D composite scenes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.