Patterned metal layer to control solder connection between laser and submount in a magnetic head
US9171562B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2015 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Mar 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laser diode device is affixed to a mounting face of a slider, opposite the air bearing surface. The laser includes a submount having an electrically conductive surface layer that is normal to the mounting face. The electrically conductive surface layer is a patterned metal layer that includes a lateral probing region and a laser mounting region to which a laser is soldered. The laser mounting region is connected to the lateral probing region by a bridge portion of the patterned metal layer. The laser mounting region is otherwise separated from the lateral probing region by a solder blocking gap in which the submount lacks the patterned metal layer, and which is adjacent to the laser. The solder blocking gap defines a solder blocking gap height normal to the mounting face that is in the range of ⅔rds to ⅚ths of a total height of the laser mounting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.