Ground-referenced single-ended system-on-package
US9171607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Jul 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0276
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.