Substrate treatment apparatus and method for manufacturing thin film
US9171745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2010 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | May 20, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/0486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a substrate treatment apparatus capable of suppressing adherence of dust to a film coated on a substrate. As an aspect of the present invention is a substrate treatment apparatus provided with a spin-coating treatment chamber 4a for coating a film on the substrate by spin-coating, a first air-conditioning mechanism that regulates an amount of dust in the air in the spin-coating treatment chamber, an annealing treatment chamber 7a for performing lamp annealing treatment on the film coated on the substrate, a conveying chamber 2a that is connected to each of the spin-coating treatment chamber and the annealing treatment chamber and is for conveying the substrate between the spin-coating treatment chamber and the annealing treatment chamber each other, and a second air-conditioning mechanism that regulate an amount of dust in the air in the conveying chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.