Methods and apparatus for transmission lines in packages
US9171798B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Oct 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.