Semiconductor device
US9171817B2 · kind B2 · utility
1Cited by
1References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Aug 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip having an electrode, a connector having a chip contact surface, an interconnecting portion, and an external electrode terminal contact surface, the chip contact surface being electrically connected to the electrode, and a first connection material disposed between the chip contact surface and the electrode, the first connecting material having a surface area that is greater than a surface area of the chip contact surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.