Flip chip type light emitting diode and manufacturing method thereof
US9171995B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 2012 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | May 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.