Encapsulation structure for an opto-electronic component

US9172057B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Richard Baisl · Regensburg, DE
• Dirk Becker · Bad Hersfeld, DE
• Thomas Dobbertin · Regensburg, DE
• Doreen Heppner · Altötting, DE
• Benjamin Claus Krummacher · Regensburg, DE
• Erwin Lang · Regensburg, DE
• Tilman Schlenker · Nittendorf, DE
• Christian Schmid · San Diego, US

Key dates

• Filing date: Jun 20, 2012
• Grant date: Oct 27, 2015
• Expiry date: Jun 20, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K30/88

Abstract

An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.