Heat dissipation assembly with bidirectional airflow
US9173323B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Oct 27, 2015 |
| Priority date | — |
| Expiry date | Nov 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly is configured in an enclosure of a network device. The enclosure defines an air flue. The heat dissipating assembly includes a fan module received in the air flue, and a damper module secured in one end of the air flue adjacent to the inside of the enclosure. The fan module includes a first bracket and a plurality of fans fixed with the first bracket. The damper module includes a frame and a plurality of vanes located in the frame. When a direction of airflow of the plurality of fans changes, the plurality of fans in the air flue is reversed, and the first bracket supports the plurality of vanes of the damper module to keep the air flue open.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.