Devices and methods for analyzing spatter generating events
US9174294B2 · kind B2 · utility
11Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2012 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Dec 4, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for monitoring a spatter generating event during a welding application. The method includes capturing data that corresponds to a welding current of the welding application. The method also includes detecting parameters associated with a short circuit from the captured data. The method includes analyzing the detected parameters to monitor the spatter generating event during the welding application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.