Substrate cutting apparatus and method for cutting substrate using the same
US9174307B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2010 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Oct 4, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/093
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.