Positioning mechanism and bonding device using the same
US9174424B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A positioning mechanism includes a loading assembly and a clamping assembly. The clamping assembly includes a driver mounted on the bottom of the loading assembly, at least two sliding members driven by the driver, and at least two clamping subassemblies mounted on the top of the loading assembly. The clamping subassemblies are divided into two groups and are arranged and mounted adjacent to opposite sides of the loading assembly, and the sliding members are connected to the two groups of the at least two clamping subassemblies, respectively. The driver is capable of driving the sliding members to move away from or toward each other to enable the two groups of the clamping subassemblies to move toward or away from the loading assembly to clamp or release a workpiece on the loading assembly. The present invention further discloses a bonding device using the positioning mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.