Liquid ejection head and method for manufacturing liquid ejection head
US9174439B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2013 |
| Grant date | Nov 3, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1643
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.